part number: XZTHI45S 3.5x2.8 mm infrared emitting diode oct 11,2016 xdsb5013 v4-z layout: maggie l. p. 1/5 package schematics notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. specifications are subjec t to change without notice. part number emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZTHI45S gaalas water clear 1.2* 1.8* 880* 120 radiant intensity cie127-2007* (po = mw/sr) @20ma features long life and robust package standard package: 2000pcs/ reel msl (moisture sensitivity level): 3 rohs compliant absolute maximum ratings (t a =25c) thi (gaalas) unit reverse voltage v r 5 v forward current i f 50 ma forward current (peak) 1/100 duty cycle 10us pulse width i fs 1200 ma power dissipation p d 80 mw operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 thi (gaalas) unit forward voltage (typ.) (i f =20ma) v f 1.3 v forward voltage (max.) (i f =20ma) v f 1.6 v reverse current (max.) (v r =5v) i r 10 ua wavelength of peak emission cie127-2007* (typ.) (i f =20ma) p 880* nm spectral line full width at half-maximum (typ.) (i f =20ma) 50 nm capacitance (typ.) (v f =0v, f=1mhz) c 90 pf operating characteristics (t a =25c) *radiant intensity value and wavelength are in accordance with cie127-2007 standards. a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033)
part number: XZTHI45S 3.5x2.8 mm infrared emitting diode oct 11,2016 xdsb5013 v4-z layout: maggie l. p. 2/5 handling precautions compare to epoxy encapsulant that is hard and brittle, s ilicone is softer and flexible . although its characteristic significantly reduces thermal stress, it is more susc eptible to damage by external mechanical force. as a result, special handling precautions need to be ob served during assembly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing exposed leds. impact may scratch the silicone lens or damage the internal circuitry. 4.1. the inner diameter of the smd pickup nozzle should not exceed the size of the led to prevent air leaks. 4.2. a pliable material is suggested for the nozzle tip to av oid scratching or damaging the led surface during pickup. 4.3. the dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. as silicone encapsulation is permeable to gases, some corrosive substances such as h 2 s might corrode silver plating of leadframe. special care should be taken if an led with s ilicone encapsulation is to be used near such substances.
part number: XZTHI45S 3.5x2.8 mm infrared emitting diode oct 11,2016 xdsb5013 v4-z layout: maggie l. p. 3/5 ? thi led is recommended for reflow soldering and soldering profile is shown below.
part number: XZTHI45S 3.5x2.8 mm infrared emitting diode oct 11,2016 xdsb5013 v4-z layout: maggie l. p. 4/5 ? the device has a single mounting surface. the device must be mounted according to the specifications. ? recommended soldering pattern (units : mm; tolerance: 0.1) ? reel dimension ? tape specification (units : mm) remarks: if special sorting is required (e.g. binning based on forward voltage or radiant intensity / luminous flux), the typical accuracy of the so rting process is as follows: 1. radiant intensity / luminous flux: +/-15% 2. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters
part number: XZTHI45S 3.5x2.8 mm infrared emitting diode oct 11,2016 xdsb5013 v4-z layout: maggie l. p. 5/5 packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp xzxxx45x
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